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ADP5501
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VBAT to GND
VDDIO to GND
SW/BST to GND
LED0/LED1/LED2/CMP_IN/SCL/SDA/INT/
RST/CAP_OUT/BL_SNK to GND
PGND to GND
Rating
–0.3 V to +6 V
–0.3 V to VBAT
–0.3 V to +30 V
–0.3 V to +6 V
–0.3 V to +0.3 V
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to GND.
THERMAL RESISTANCE
θ JA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Operating Ambient Temperature Range
Operating Junction Temperature Range
?40°C to +85°C 1
–40°C to +125°C
Package Type
24-Lead LFCSP_VQ
θ JA
50
Unit
?C/W
Storage Temperature Range
–65°C to +150°C
In applications where high power dissipation and poor thermal resistance
Soldering Conditions JEDEC J-STD-020
1
ESD CAUTION
are present, the maximum ambient temperature may have to be derated.
Maximum ambient temperature (T A(MAX) ) is dependent on the maximum
operating junction temperature (T J(MAXOP) = 125°C), the maximum power
dissipation of the device (P D(MAX) ), and the junction-to-ambient thermal
resistance of the part/package in the application (θ JA ), using the following
equation: T A(MAX) = T J(MAXOP) – (θ JA x P D(MAX) ).
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. 0 | Page 5 of 28
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